CERN chips employ Leti’s TSV technology
Categorie(s) : Industry, MINATEC, News, Research
Published : 10 June 2013
Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament connections—which typically cover 6%–10% of a detector’s surface.
Leti’s Open3D® platform develops technology bricks for outside customers for preseries runs. The first chips for the CERN are currently in the testing phase.