Replisaurus has developed a revolutionary process that will ultimately enable copper interconnect patterns to be deposited on wafers in just three steps, as opposed to eight steps today.
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This breakthrough technology is currently the focus of research being conducted at MINATEC via a joint lab with CEA-Léti, as well as a separate joint project for which the French government’s innovation financing agency, Oséo, has provided €10 million in support.
Replisaurus, which was originally founded in Sweden before moving to France, possesses 70 m2 of clean room space on the MINATEC campus and has eight employees, including three who work exclusively on building an integrated demonstrator. Replisaurus is currently creating a reusable master for the new deposition process which will provide resolution and precision properties comparable with lithography techniques. The process is also suitable for packaging, MEMS, and micro-optical components.
SET (Smart Equipment Technology), a Replisaurus subsidiary located in Saint-Jeoire, France (about 100 kilometers from Grenoble), is the world’s leading manufacturer of high-accuracy device bonders, which are used in the process. SET is expected to begin shipping its first volume orders for the equipment in early 2012. The company’s staff in Grenoble is expected to double in size within the next few years.
Learn more at: www.replisaurus.com
