Thesis, internship, and post-doc opportunities
Study of adhesions in polymer bonding for microelectronic applications
Offer N°: SL-DRT-15-1117
The subject deals with polymer bonding as used in microelectronics. Adhesive bonding is widely used: MEMS and microfluidic devices elaboration or for wafer to wafer transfer of thin films and devices for 3D applications. The goal of the PhD is to better understand the mechanism involved in the polymer bonding processes and to propose improvements. The results will be applied to the case of temporary bondings.
Work description (13 lines maximum):
Colocalized nano-characterization of defaults and luminescence in InGaAs/GaAs quantum well
Offer N°: SL-DRT-15-1121
Integration of III-V materials grown on silicon substrate for nanoelectronic applications (high mobility transistors for example) is conditioned by the high quality of the material. This work is in the field of the nanocharacterization of extended defects in III-V material grown by epitaxy on silicon.
Advanced plasmonics for the study of biological events
Offer N°: SL-DSM-15-1104
The Spram, the LN2 (Sherbrooke) develop new and complementary optical approaches to measure biological interactions. New ideas are emerging from these recent progresses in advanced plasmonics and we propose to study the behavior of bacteria interacting with solid surfaces.