Thesis, internship, and post-doc opportunities

154 results found

[Thesis]

Study of adhesions in polymer bonding for microelectronic applications

Offer N°: SL-DRT-15-1117

Start date: 1 Oct 2015

The subject deals with polymer bonding as used in microelectronics. Adhesive bonding is widely used: MEMS and microfluidic devices elaboration or for wafer to wafer transfer of thin films and devices for 3D applications. The goal of the PhD is to better understand the mechanism involved in the polymer bonding processes and to propose improvements. The results will be applied to the case of temporary bondings.

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[Thesis]

Colocalized nano-characterization of defaults and luminescence in InGaAs/GaAs quantum well

Offer N°: SL-DRT-15-1121

Start date: 1 Sep 2015

Integration of III-V materials grown on silicon substrate for nanoelectronic applications (high mobility transistors for example) is conditioned by the high quality of the material. This work is in the field of the nanocharacterization of extended defects in III-V material grown by epitaxy on silicon.



[Thesis]

Advanced plasmonics for the study of biological events

Offer N°: SL-DSM-15-1104

Start date: 1 Nov 2015

The Spram, the LN2 (Sherbrooke) develop new and complementary optical approaches to measure biological interactions. New ideas are emerging from these recent progresses in advanced plasmonics and we propose to study the behavior of bacteria interacting with solid surfaces.



[Thesis]

Study of formation and degradation of ultrathin Ti & Ni siliicides on Ge rich SiGe layer: application to advanced & disruptive CMOS technology

Offer N°: SL-DRT-15-1087

Start date: 1 Oct 2015



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