Encapsulation and interconnection of microelectronic components in a flexible and conformable film

Published : 19 December 2016

The objective of the PostDoc will be the development of an innovative process of encapsulation and interconnection of heterogeneous electronic components in a multilayer flexible substrate.

The PostDoc will participate in the identification of flexible materials and processes associated taking into account existing technologies. The different steps of the integration process should be identified and studied, both from the perspective of technological feasibility as the scientific understanding of physical and chemical phenomena involved.


•Benchmarking: polymers

•Design / Simulation

•Definition of test vehicle

•Process development in clean room


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