New packaging for power electronics : application to SiC components
Published : 19 December 2016
In continuity of ongoing work (PhD thesis) on the 3D assembly of vertical Silicon power components, the purpose of the post-doc proposal is to develop a similar assembly on vertical wide-gap SiC power components. The required work will be to define the components (high frequency / high voltage) with the supplier and to adapt them to the best vertical integration (Cu finishing, topology,…), to adjust the metal leadframe design for the 3D assembly, and to develop the transfer layer technology adapted to this new material. The candidate will also take care of the electrical characterizations of the final stack to validate the interest of this 3D packaging on wide-gap power devices.