MINA-NEWS #17 - December 2011
Notable number: 87%
Primary technology research rarely delivers high production yields immediately, especially for functional products. And yet, yields of 87% were recently achieved on 3D circuit demonstrators for wireless applications. Compared with conventional 2D demonstrators for the same circuits, these 3D demonstrators incorporate several technological advancements developed by STMicroelectronics and Leti—including the stacking and partitioned design of the two components and backside interconnect vias and routing, all using a 65 nm CMOS process. These results come thanks to Leti’s long-standing successful collaboration with Brewer Science, EVG, Amat, STMicro, and STEricsson, and pave the way for groundbreaking new applications.