MINA-NEWS #18 - February 2012
SEMI Europe sets sights on 450 mm packaging
Ensuring that packaging and assembly technologies can be adapted to 450 mm wafers is an emerging issue among microelectronics industry insiders. That’s why SEMI Europe plans to hold a half-day meeting on April 24 to discuss 450 mm and panel-scale packaging technology.
The event will be open to microelectronics equipment, materials, and process suppliers; integrators; foundries; researchers; and students. Participants will get a valuable opportunity to discuss their viewpoints, experiences, and challenges. The meeting will be of particular interest to attendees of the MiNaPAD conference, another event dedicated to packaging and assembly which will take place just after the SEMI Europe meeting