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Opportunities Thesis, Internship , Post-doc

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Thesis

Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging

Start date : 2024 Nov 01

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Internship

Silicon Carbide microelectrode array for neural interfacing

Start date : 2024 Mar 01

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Post-doc

Post-doctoral Position in SiC-based-FET Biosensors

Start date : 2024 Feb 01

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