News : Innovation & Society

December 06 2022

Clinatec Endowment Fund raises awareness of biomedical research

  • Innovation & Society
  • News
What if light could be used as a drug? That’s the question asked on half of all Grenoble’s city buses over the course of a week this fall. The high-impact advertising campaign, run by the Clinatec Endowment Fund, was timed to coincide with World Alzheimer’s Day on September 21. The aim was simple: to raise […] >>

December 06 2022

CEA-Leti to put digital health in the spotlight at CES 2023 in Las Vegas

  • Innovation & Society
  • News
CEA-Leti will be exhibiting at the Consumer Electronics Show again this year, presenting three projects in the field of digital health. CES—the world’s largest trade show in the industry—will take place in Las Vegas from January 5 to 8.The first project is CEA-Leti startup Admir, which won a 2022 i-lab award. Admir has developed an […] >>

December 05 2022

Vibration: new hope in the fight against cancer

  • Innovation & Society
  • News
  • Research
Researchers from Irig and Inserm recently made a surprising and promising discovery: Cancerous cells die spontaneously (apoptosis) on contact with magnetic particles vibrating at between 2 Hz and 5 Hz under the influence of an external field. The phenomenon is being investigated further by a Spintec-LTM PhD candidate, who is measuring the forces at work […] >>

December 05 2022

Low-cost, global IoT connectivity now a reality

  • Innovation & Society
  • News
  • Research
A CEA-Leti team has designed an ultra-low-power radiofrequency chip that connects fixed or mobile IoT devices to nanosatellites manufactured by the Swiss company Astrocast. Terrestrial IoT networks cover a mere 15% of the planet’s surface, meaning that this new technology is desperately needed in industries such as maritime transportation, fishing, and offshore oil, which operate […] >>

December 05 2022

Micron-level accuracy in die-to-wafer bonding

  • Innovation & Society
  • News
  • Research
CEA-Leti and equipment manufacturer SET have developed a new hybrid die-to-wafer bonding process that boasts micron-level accuracy. The solidity of the bond is achieved using the molecular force between the copper and oxide surfaces alone. Several patents have already been filed for this now-mature technology, which will soon be brought to market in a new […] >>
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