SET, from the French Alps to the world
Categorie(s) : Industry, News, Research
Published : 7 December 2021
Qualification testing took place in several stages as part of research for the IRT Nanoelec 3D program and was completed in 2019. Several papers were presented at major conferences as a result of this research. So, when SET first commercialized the NEO HB, it was already well-known and sales ramped up quickly.
SET, the world’s leading supplier of flip-chip machines, will now add a new solution to its lineup.
*In flip-chip assembly, the die is attached bond pad side down to the substrate using conductive bumps.