Circuit / substrate co-design for 5G Front-End-Module RF applications

Published : 8 October 2019

The Front End Module (FEM) represents a significant part of a smart phone cost (>3x the application processor). Today, each new smart phone generation contains an increasing FEM area fabricated with RFSOI technology (20x between 2010 and 2016), a dedicated device technology on a dedicated substrate, where STMicroelectronics and Soitec offer state-of-the-art products. Soitec substrates already allow a strong second harmonic attenuation on passive structures. Technology solutions exist to provide:

– a higher degree of linearity

– temperature-independent linearity

– intermediate linearity at lower cost.

These solutions have not yet been industrialized.

The purpose of this PhD work is to:

– optimize the design of one or more FEM functional blocks using state-of-the-art PDSOI technology,

– have these circuits fabricated

– measure the circuit performance and evaluate the benefit of exploratory substrates.

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