Development and characterization of a new process for interconnection of high-performance electronic components by sintering nanoparticles
Published : 8 February 2020
Electronic components are becoming more and more efficient. Packaging must then adapt so as not to be the limiting factor. All current studies aim to improve the performance of the modules while taking into account the environmental context, which aims to limit the use of substances harmful to man and the environment. Sintering, particularly silver sintering, stands out today for the integration of semiconductor chips on substrates. It has excellent thermal and electrical performances (silver is the best conductor among all metals), and is perfectly stable in temperature (the sintering process is carried out below 300°C, but then supports temperatures of more than 900°C). In addition, the sintered joint is free of harmful substances, since it contains only silver. Today, power electronics is the main application that drives developments of sintering interconnection, with a use for electric or hybrid vehicles, for aeronautics, etc. LED also turn to sintering (especially automotive lighting).
The miniaturization of microsystems raises new challenges, such as the development of assembly processes adapted to sintering. The aim of the thesis will be to develop a sintering process for a direct contact semiconductor chip (Flip-Chip) on a substrate with pads whose diameter is less than 300µm. The process will be tested and characterized on a test vehicle designed as part of this study.