Study and control of Intermetallic compounds formation in indium based interconnects
Published : 11 June 2019
CEALETIDOPT develops photonic components such as micro-displays, or infrared detectors by 3D integration that is a modern way for electronic packaging, where devices are stacked on top of each other or packaged. The electrical, optical and/or thermal connections are created between the stacks and package with the help of interconnects. The interfacial intermetallic (IMC) layer formed at metal/metal interface plays a crucial role in determining the properties and reliability of the joint/interconnect.
In this work, we will focus on IMC formation in indium balls interconnects that becomes an issue (reliability) when fine pitches (below 10µm) are reached. This study will be divided into 3 parts:
– Understanding of IMC formation in current configuration
– Improvement of the configuration so as to control IMC formation