Wettability and adhesion mechanism of adhesive in hybridized structure , functionalized and underfilled , based on Cu pillars interconnexions

Published : 13 February 2020

The assembly of electronic components using the flip chip technology are widely present in the mass product markets as mobile phones, civilian ,medical or military market.the high count number of input output which can be higher that one million , with low pixel pitch , and small hybridization height .The underfilling of these structures is a key point for the robustness and the reliability of such packaging.It’s a big challenge to perform such filling operation in hybridized components using the copper pillars interconnection technology ,without voids defects or adhesion weakness or variation in the adhesive thickness.

The study proposed here is to inject in a gas phase mode a wetting product wich cover all the internal surface to be underfilled .This nanometric layer has to be characterized exhaustively to check its presence and thickness and how it react with all the encountered surfaces , the behaviour with parameters like temperature , queue time after deposition , and the usual reliability cycling programs.

The key parameter to understand here is the adhesion of the underfilling époxy adhesive to all the surfaces and what is the mechanism of adhesion and the impact on reliability of the assembly with this wetting material, by chemical and thermal characterizations.

Understand what is the major contribution of this treatment to the microelctronic industry.

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