Superhydrophobic surface integration for Die-to-Wafer hybrid bonding by self-assembly.

Publié le : 8 octobre 2019

Context :
Die-to-wafer stacking is foreseen by major microelectronic industrials as essential for the success of future memory, photonic devices or high performance computing involved in Artificial Intelligence booming. CEA-Leti demonstrated Die-to-Wafer with hybrid bonding which significantly reduces the electrical interconnection pitch compared to standard bonding techniques. Die alignment time is identified as the main limiting factor for industrialisation. Self-assembly is a very promissing technique to drastically increase throughput. This process is based on a water droplet confinement thanks to a hydrophillic/hydrophobic contrast. The die is deposited on the droplet and self-alignment is realized due to capillarity forces.

Job description :
The internship objective is to integrate a superhydrophobic surface in order to optimize the hydrophobic/hydrophillic contrast for Die-to-Wafer hybrid bonding by self-assembly.
Integrated in Thin Film Integration laboratory within the hybrid bonding team, the candidate will be in charge of :
-Innovative designs and structures proposals, participation to new masks elaboration
-Sample realization : wafers follow up on 200mm/300mm Leti fab line.
-Morphological characterization (topography, cross sections) and water contact angle measurement
-Validation of developed Die-to-Wafer integration scheme by self-assembly process in collaboration with process team.

If you are interested by the internship, please send your CV and motivation letter to

En naviguant sur notre site, vous acceptez que des cookies soient utilisés pour vous proposer des contenus et services adaptés à vos centres d’intérêts. En savoir plus