Superhydrophobic surface integration for Die-to-Wafer hybrid bonding by self-assembly.
Publié le : 8 octobre 2019
Die-to-wafer stacking is foreseen by major microelectronic industrials as essential for the success of future memory, photonic devices or high performance computing involved in Artificial Intelligence booming. CEA-Leti demonstrated Die-to-Wafer with hybrid bonding which significantly reduces the electrical interconnection pitch compared to standard bonding techniques. Die alignment time is identified as the main limiting factor for industrialisation. Self-assembly is a very promissing technique to drastically increase throughput. This process is based on a water droplet confinement thanks to a hydrophillic/hydrophobic contrast. The die is deposited on the droplet and self-alignment is realized due to capillarity forces.
Job description :
The internship objective is to integrate a superhydrophobic surface in order to optimize the hydrophobic/hydrophillic contrast for Die-to-Wafer hybrid bonding by self-assembly.
Integrated in Thin Film Integration laboratory within the hybrid bonding team, the candidate will be in charge of :
-Innovative designs and structures proposals, participation to new masks elaboration
-Sample realization : wafers follow up on 200mm/300mm Leti fab line.
-Morphological characterization (topography, cross sections) and water contact angle measurement
-Validation of developed Die-to-Wafer integration scheme by self-assembly process in collaboration with process team.
If you are interested by the internship, please send your CV and motivation letter to email@example.com