MINATEC in figures

Researchers at IBS* are using protein antigens characteristic of melanoma, a particularly aggressive form of skin cancer, to explore whether or not stimulating a patient’s immune system can enhance treatment of the disease. The antigens would be vectorized by a non-infectious particle derived from the adenovirus. Cancer generally attenuates a patient’s immune response. Here, the idea is to stimulate a strong immune response with a vaccine. One additional benefit of this type of vaccine is that it would be easy… More information

The Carnot QPIC* project has been up and running in the photonics building since last fall. The researchers assigned to the project are developing components and integrated circuits for quantum communications, where information is transmitted in the form of single protons, making the technique intrinsically secure. With quantum communications, any attempt to hack into the data can be detected, making it just the kind of secure technology the finance, healthcare, energy, telecoms, and defense industries are seeking. CEA-Leti is leading… More information

Selective-area laser deposition, or SALD, offers the advantages of being fast and suitable for use on large surfaces. Researchers at LMGP have made SALD even better with a new innovation. They took advantage of the design flexibility offered by 3D printing to come up with customizable and affordable SALD injection heads. The pen-style SALD injection heads can be mounted on an XYZ machine to perform selective 3D chemical deposition of functionalized materials with no need for masks or a vacuum… More information

Spintec is shaping the future of spintronics research, with Scientific Director Bernard Diény (first author) and four other Spintec researchers among the sixteen authors of the international spintronics roadmap published in Nature Electronics in 2020. The roadmap highlights a major trend: Spintronics, once only for data storage, is now making inroads into microelectronics. MRAM memory has already entered volume production at Samsung, Intel, and other major manufacturers. High-density, low-power chips made by integrating spintronic devices onto CMOS components are currently… More information