News : Research
June 10 2013
Even faster multi-core processor calculations
- MINATEC
- News
- Research
Grenoble-based engineers from CEA-List have more than doubled the speed of a matrix multiplication program using a new dynamic compilation method. This method, designed specifically for multi-core processors, works by optimizing the execution of the most calculation-intensive sections of code. It offers an attractive alternative to static compilation, which optimizes the overall code using conservative […] >>
June 10 2013
BeSpoon sets a world record at 3,641 meters
- Industry
- News
- Research
Locating an object to within just a few centimeters sounds easy—except when you are over 3.6 km away. But that’s what French start-up BeSpoon was able to do using impulse radio ultra-wideband (IR-UWB) technology developed by Leti. This range of 3,641 meters sets a world record based on emergency situation UWB regulations; the range based […] >>
June 10 2013
CERN chips employ Leti’s TSV technology
- Industry
- MINATEC
- News
- Research
Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>
June 10 2013
Phelma introduces a work-study program for micro and nanoelectronics
- Education
- Life @ MINATEC
- News
- Research
This fall Grenoble Institute of Technology-Phelma will kick-off France’s first work-study program for micro and nanoelectronic systems design. This program was developed in association with Grenoble-area high-tech businesses and was approved by the regional government in April 2013. The program will give engineers the theoretical knowledge and real-world experience to design integrated systems. It aims […] >>
June 10 2013
Aledia powers ahead at light(n)ing speed
- Industry
- MINATEC
- News
- Research
Aledia, a start-up spun off from Leti, has just crossed two important milestones. First, it has finished making its first series of LEDs on 200 mm silicon wafers—a breakthrough process that cuts LED production costs by a factor of four relative to conventional methods. And second, the young firm has raised €10 million of fresh […] >>


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