DNA could bring new innovations to microelectronics

Categorie(s) : Events, Innovation & Society, MINATEC, Research

Published : 6 December 2016

Recent advances in research being conducted by Leti and INAC scientists under CEA project A3DN could help overcome one of the major technological hurdles facing microelectronics R&D.

So, what does DNA have to do with microelectronics? DNA strings measure around a nanometer—as do the pattern geometries the researchers are working on. And DNA’s base-pairing capacities can ensure more accurate pattern alignment than the most powerful microelectronics technologies currently available.
Pattern alignment—between active circuit components or levels—has to be perfect for the electronic signals to be transmitted. The smaller the geometries, the more difficult it is to align the patterns.

Cost-competitive custom designs
In other good news, DNA strings can be used to create custom designs at very competitive costs.
The Leti and INAC researchers working on the A3DN project made suspended conductive nanowires from metal-coated DNA fragments. The nanowires could be used in NEMS.
The researchers also deposited high-density nanometric origami-like DNA structures (period values less than 15 nm) onto a substrate, and then transferred the patterns using traditional lithography.
These very encouraging research results could open up a wide range of opportunities in nanoelectronics, micro and nanosystems, biochemistry, nanocharacterization, and more.

Contact: raluca.tiron@cea.fr

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