News : Engineering sciences

March 19 2024

Co-Integration of Photonic Multichip Module for THz Frequency Generation

                                                    PhD Position 2024: Co-Integration of Photonic Multichip Module for THz Frequency Generation   KEYWORDS : Laser, Integrated Optics, TeraHertz, Communications CONTEXT: The technological development of communications devices, new and futures uses such as video conferencing, streaming, Internet of Things (IOT), 6G, AI, continue to further increase the pressure […] >>

January 30 2024

Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging

Thesis topics 2024 Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging Contexte et objectif : Dans le cadre d’un projet IPCEI (Projets Importants d’Intérêt Européen Commun) en  collaboration avec la société STMicroelectronics, nous nous intéressons à la caractérisation  diélectrique hautes fréquences (jusque 100 GHz) de résines de […] >>

December 13 2023

Silicon Carbide microelectrode array for neural interfacing

  M2 INTERSHIP Silicon Carbide microelectrode array for neural interfacing   Electric brain computer interfaces are based on electrode that collect or stimulate the neural activity. For two decades many types of intracortcial microelectrode arrays have been developed  nevertheless long lasting neural implants are still missing to allow a proper of this technology toward clinical […] >>

December 01 2023

Characterization of high-k dielectric/silicon interfaces using second harmonic generation (SHG)

                                                    2 YEARS POSTDOCTORAL FELLOW POSITION                                                               Characterization of high-k dielectric/silicon interfaces                                                             using second harmonic generation  (SHG)                                                                                                 Starting date:  January- February 2024                                                                                                    Within the IPCEI (Important Project of Common European Interest) on Microelectronics, we work (in collaboration with STMicroelectronics) on the development of a non-destructive characterization method adapted for interfaces between passivation […] >>

December 01 2023

Characterization of dielectric/silicon interfaces using second harmonic generation

    MASTER 2 INTERNSHIP PROPOSAL                                                               Characterization of dielectric/silicon interfaces                                                             using second harmonic generation                                                                                                      Starting date: February 2024                                                                                                     Duration: 5-6 months The microelectronics and optoelectronics industry relies on complex dielectric/silicon stacked  structures. Such structures, which are needed in cameras, displays, MOS transistors, …, must have very well-defined material properties but also […] >>
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