News : Engineering sciences

Simulation, fabrication and characterization of transparent piezoelectric transducers based on ZnO nanowires Detailed Topic Piezoelectric devices are attracting growing interest as a micro-source of energy by harvesting mechanical ambient energy, and as sensors via the direct piezoelectric effect. In this context, semiconducting materials in the form of nanowires constitute a promising building block for the […] >>

                                                    PhD Position 2024: Co-Integration of Photonic Multichip Module for THz Frequency Generation   KEYWORDS : Laser, Integrated Optics, TeraHertz, Communications CONTEXT: The technological development of communications devices, new and futures uses such as video conferencing, streaming, Internet of Things (IOT), 6G, AI, continue to further increase the pressure […] >>

Thesis topics 2024 Development and implementation of microwave characterization techniques for molding resins used in 3D integrated circuit packaging Contexte et objectif : Dans le cadre d’un projet IPCEI (Projets Importants d’Intérêt Européen Commun) en  collaboration avec la société STMicroelectronics, nous nous intéressons à la caractérisation  diélectrique hautes fréquences (jusque 100 GHz) de résines de […] >>

  M2 INTERSHIP Silicon Carbide microelectrode array for neural interfacing   Electric brain computer interfaces are based on electrode that collect or stimulate the neural activity. For two decades many types of intracortcial microelectrode arrays have been developed  nevertheless long lasting neural implants are still missing to allow a proper of this technology toward clinical […] >>

                                                    2 YEARS POSTDOCTORAL FELLOW POSITION                                                               Characterization of high-k dielectric/silicon interfaces                                                             using second harmonic generation  (SHG)                                                                                                 Starting date:  January- February 2024                                                                                                    Within the IPCEI (Important Project of Common European Interest) on Microelectronics, we work (in collaboration with STMicroelectronics) on the development of a non-destructive characterization method adapted for interfaces between passivation […] >>