83 results found


Real-time calibration of a video stream on an embedded platform

Offer N°: SL-DRT-15-0386

Start date: 1 Sep 2015

This thesis investigates camera calibration methods in a real-time embedded context. The main goal is to propose an innovative processing architecture that enables execution of online autocalibration algorithms in single or multi-views. This architecture will be compliant with embedded system constraints (small footprint and low power consumption) and powerful enough to cope with the execution of applications with high reactivity requirements.


Development of Scanning Thermal Microscopy for nanoscale characterization and its application to the thermal optimization of phase change memories.

Offer N°: SL-DRT-15-0093

Start date: 1 Oct 2015

This project aims at developing a Scanning Thermal Microscope (SThM) for the characterization of materials and structures at the nanometric scale. This represents an important challenge at the international level since few teams are today able of performing absolute measurements of temperature and heat flows at this scale. The actual resolution of the SThM developed up to now allows to investigate objects that are of the order of hundred nanometers.


Application - Java Virtual Machine interaction for compilation

Offer N°: SL-DRT-15-0481

Start date: 1 Oct 2015

The PhD objective is to give access to low level code generation at the application level in a Java Virtual Machine (JVM). This objective become necessary because application performances are more and more sensitive to the data set characteristics and because it become difficult to use Java in embedded systems and/or high performance applications.


Development of ultra fine pitch interconexion array

Offer N°: SL-DRT-15-0971

Start date: 1 Dec 2014

The Optics and Photonics Department of CEA/LETI is involved in the assembly of imaging components (such as Infrared detectors or microdisplays) on CMOS circuits. In this area one of the driving element for a better resolution is the pitch reduction. If some interconnection technologies exist, the assembly of components with an ultrafine pitch (<5-10µm) requires new development.

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