[Thesis]
Development of advanced interconnections for power applications and study of their reliability
Offer N°: 14118
Start date: 1 Sep 2013
To respond to requirements for environmental protection and alternative energies (solar panels, wind energy, electrical vehicles), CEA-LETI is developing power devices based on HEMT GaN technology (High Electron Mobility Transistor on Gallium Nitride semiconductor). On top of these GaN transistors, a metallic network (also called interconnects) is fabricated to bring current and voltage to the source and drain electrodes of the components.
Send to a friend
Show complete offer
Close[Thesis]
Advanced Patterning process development for sub 14nm CMOS technology
Offer N°: 14116
Start date: 1 Oct 2013
For sub 14nm CMOS technology, Optical lithography based Patterning techniques are limited in terms of minimum dimension and minimum pitch. Alternative techniques, such as ebeam lithography, spacer patterning & direct self assembly, are able to overcome the sub 14nm challenges. One of the key points of such patterning techniques is to have innovative plasma etch processes that will enable the integration of these solutions.
[Thesis]
Error correction exploiting the properties of emerging digital memories
Offer N°: 14112
Start date: 1 Sep 2013
Storage memory is one of the major components of modern electronic systems (smart phone, digital camera …). Besides being non-volatile, an ideal storage memory must be fast, dense, power frugal and cheap. Several new non-volatile memories are currently developed (M-RAM, PC-RAM, CB-RAM, Ox-RAM). For some of them, electrical parameters (charge, resistance) used to encode the binary or multi-valued information in storage cells are distributed over a continuous range.
[Thesis]
Micrometer scale lead free solder connexions for advanced 3D integration : metallurgical mechanisms study and optimization
Offer N°: 14110
Start date: 1 Oct 2013
3D integration, technology which consists in stacking vertically several chips of various technologies requests the soldering of these chips using lead free materials and more specifically Tin/Silver. The soldering metallurgy of such materials on interconnect metals (Copper, Nickel) has recently been widely studied and is well known for macroscopic scales.