81 results found


Quality of Service management for distrubuted embedded systems

Offer N°: SL-DRT-15-0659

Start date: 1 Oct 2015

One of the great challenges of intelligent building and smart home is the interconnection of so called smart objects, whether they are integrated to the building (building management systems, home networks) or specific to the user (brown goods, white goods, portable goods). This interconnection is made difficult by the variety of technologies and the multidisciplinary nature of the objects involved.


Development of high resolution photo-modulated Kelvin Probe Force Microscopy for photovoltaics

Offer N°: SL-DRT-15-0619

Start date: 1 Oct 2015

Nowadays, improvements in performance of third generation solar cells are strongly dependent on developing advanced characterization tools capable of mapping the opto-electronic properties of photovoltaic (PV) materials at the nanometer scale. Within the Nano characterisation platform (PFNC), we develop advanced approach based on Atomic Force Microscopy (AFM) and its electrical modes such as Kelvin Probe Force Microscopy (KPFM).


Fabrication and testing of multijunction IIIV on Si solar cells

Offer N°: SL-DRT-15-0714

Start date: 1 Oct 2015

The crystal Silicon photovoltaic industry recently demonstrated record efficiency values over 25%, approaching the Si theoretical limit. Multijunction solar cells based on IIIV materials can overcome this limit: efficiencies over 44% have been reported on 4 junctions under 247suns. Due to the elevated cost of these cells, this technology is dedicated to high concentration.

An intermediate solution consists in combining IIIV and Si materials in order to:


MEMS inertial sensors design and fabrication based on an innovative process

Offer N°: SL-DRT-15-0727

Start date: 1 Sep 2015

The inertial MEMS sensors market, principally driven by Smartphones, automotive and connected objects, is huge and is still growing. This results in a high pressure on price, which means a global race focusing onto miniaturization.

A new architecture and its manufacturing process, patented by CEA-Léti, opens the way for a new generation of sensors whose surface could be divided by three, for the same performance.

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