63 results found


Angle sensitive pixel for CMOS image sensor

Offer N°: SL-DRT-16-0559

Start date: 1 Oct 2016

CEA/LETI is a leading institute of technological research in France, transferring fundamental research to industry. As a part of the optics and photonics LETI's department (DOPT), visible image sensor lab (LIV) is focused on innovative solutions for CMOS image sensor. Inside this scope, we want to develop new kind of pixels called “angle sensitive pixel”. Such pixels make possible extra-thin sensor as they don't require objective lens to be place in front of the array.


Multi-scale impact of direct bonding on the internal stresses and strains

Offer N°: SL-DRT-16-0557

Start date: 1 Oct 2016

Direct bonding is increasingly used for the development of very small structures (MEMS, NEMS, ...) and for applications requiring a very precise alignment of the bonded surfaces (3D integration). However, the internal deformations potentially induced by the bonding can disturb the alignment of the two wafers at the scale of each component. Internal stresses that will result can also disrupt the operation of very small devices and deteriorate their performance.


Connection of three-dimensional assemblies under extreme conditions: refractory materials studies

Offer N°: SL-DRT-16-0505

Start date: 1 Oct 2016

Electronic components in extreme conditions of realization and / or use (high temperature processes, electrical stress ...) are prominent in various fields of applications such as avionics, automotive or the management of electricity distribution networks. These extreme conditions make obsolete the use of transition metal layers commonly used in bonding metal: Copper, Gold, Titanium, eutectic compounds ...

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