81 results found

[Thesis]

Design of test structures for electrical characterization of performance for high density 3D interconnects and technological development

Offer N°: SL-DRT-15-0627

Start date: 1 Sep 2015

3D interconnects are used for microelectronic vertical chip assembly possibly with different technology nodes. The purpose is to increase electrical performance of integrated circuits. 3D interconnects under development in the laboratory (CEA-LETI) address both internal skills and industrial collaborations. The typical dimensions of the metal resistors are in the range 1 – 5 µm.



[Thesis]

MEMS inertial sensors design and fabrication based on an innovative process

Offer N°: SL-DRT-15-0727

Start date: 1 Sep 2015

The inertial MEMS sensors market, principally driven by Smartphones, automotive and connected objects, is huge and is still growing. This results in a high pressure on price, which means a global race focusing onto miniaturization.

A new architecture and its manufacturing process, patented by CEA-Léti, opens the way for a new generation of sensors whose surface could be divided by three, for the same performance.



[Thesis]

Low temperature Electron-beam-induced current (EBIC) characterization of 3rd gen IR detectors

Offer N°: SL-DRT-15-0605

Start date: 1 Oct 2015

The optronic departement of LETI (DOPT) is a key laboratory in the field of high performance quantum IR imaging. We work in close collaboration with Sofradir, today a world leader manufacturer of high performance IR focal plane arrays. The increasing complexity of those IR retina (megapixel formats, ultra-fine pixel pitches, multicolor detection, and high operating temperature) calls for new advanced characterization methods.



[Thesis]

Indirect X-ray photon counting imager for color medical radiology

Offer N°: SL-DRT-15-0614

Start date:

As part of its activities in medical imaging, Leti has developed over several years several detectors technology, in order to propose new performance in X-ray imaging for different applications like radiology and X-ray CT scanner, gamma-camera, and for non-destructive testing. The first prototypes have shown a great interest in improving the image quality and dose reduction.



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