42 results found

[Thesis]

Development of low-k dielectrics for sequential 3D integration

Offer N°: SL-DRT-15-1128

Start date: 1 Oct 2015

Low-k dielectrics are used for insulation of interconnect levels in integrated circuits. For new applications (sequential 3D integration), it becomes necessary to have low-k materials capable of withstanding high thermal budgets (up to 550 ° C). "Conventional" materials (SiOCH or SiCNH deposited by PECVD) does not a priori meet these specifications.



[Thesis]

Study of low temperature junctions for 3DVLSI integration for 7nm node and beyond

Offer N°: SL-DRT-15-1082

Start date: 1 Oct 2015

The down scaling of MOSFET device is becoming harder and the development of future generation of MOSFET technology is facing some strong difficulties. To overcome this problem, the vertical stacking of MOSFET in replacement of the conventional planar structure is currently strongly investigated. This technic, called 3D VLSI integration, attracts a lot of attention, in research and in the industry.



[Thesis]

Electrical characterization & modeling of the trapping phenomena (BTI, RTN) impacting the reliability of nanowires transistors for sub 10nm nodes

Offer N°: SL-DRT-15-1133

Start date: 1 Oct 2015

In advanced CMOS technologies, microscopic defects localized at the Si interface or within the gate oxide degrade the performance of CMOS transistors, by increasing the low frequency noise (LFN). These defects are generally induced by the fabrication process or by the ageing of the device under electrical stress In SiGe or III-V channel transistors, their density is much higher than in silicon and their microscopic nature still is unknown.



[Thesis]

Performance and reliability characterization of M&NEMS microphones

Offer N°: SL-DRT-15-0125

Start date: 1 Oct 2015

A new concept of microphones based on the M&NEMS technology revolutionizes the design of this type of device. The M&NEMS concept, which offers a completely innovative architecture, allows treating separately the detection and electrical transduction. A complete study and characterization of these components will assess the achievable performances. In particular the efforts will be focused on noise reduction.



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