Design of test structures for electrical characterization of performance for high density 3D interconnects and technological development
Offer N°: SL-DRT-15-0627
3D interconnects are used for microelectronic vertical chip assembly possibly with different technology nodes. The purpose is to increase electrical performance of integrated circuits. 3D interconnects under development in the laboratory (CEA-LETI) address both internal skills and industrial collaborations. The typical dimensions of the metal resistors are in the range 1 – 5 µm.
Study of the intra-layer effect, diffusion effect, and shot noise for advanced lithographie
Offer N°: SL-DRT-15-0712
CEA-LETI is leading a program for enabling the Multi-beam lithography technology with low energy. In the frame of this industrial consortium, CEA-LETI is proposing a PhD to deeper understand the pattern roughness for Multi-beam lithography. In the first step the candidates will have to characterize the roughness of the pattern with Scanning Electron Microscope (SEM) and 3D Atomic Force Microscope.
Indirect X-ray photon counting imager for color medical radiology
Offer N°: SL-DRT-15-0614
As part of its activities in medical imaging, Leti has developed over several years several detectors technology, in order to propose new performance in X-ray imaging for different applications like radiology and X-ray CT scanner, gamma-camera, and for non-destructive testing. The first prototypes have shown a great interest in improving the image quality and dose reduction.
Low temperature Electron-beam-induced current (EBIC) characterization of 3rd gen IR detectors
Offer N°: SL-DRT-15-0605
The optronic departement of LETI (DOPT) is a key laboratory in the field of high performance quantum IR imaging. We work in close collaboration with Sofradir, today a world leader manufacturer of high performance IR focal plane arrays. The increasing complexity of those IR retina (megapixel formats, ultra-fine pixel pitches, multicolor detection, and high operating temperature) calls for new advanced characterization methods.