Optimization of nanosecond laser and micro-wave annealing by numerical simulation for 3D integration in nanoelectronics
Offer N°: SL-DRT-15-0752
CEA-LETI develops leading edge manufacturing processes for the advanced technology nodes in nano-electronics, and effectively transfers this knowledge to the industry. Cool-Cube® is a challenging and promising option developed at LETI to build integrated 3d components. This technology, as well as other key enabling technologies, requires new annealing processes.
SPAD for High resolution depthmap
Offer N°: SL-DRT-15-0345
SPAD (Single Photon Avalanche Diode) is the more accurate TOF (Time Of Flight) distance measurement. Some specific issues appear when SPADs are used in matrix to get a depthmap of the scene: sensitivity, compactness, internal speed and integration density are of major concern. Existing SPAD matrix do not allow a large diffusion, although the need is great to improve embedded image treatment efficiency.
CMOS imager architecture for RTS noise mitigation
Offer N°: SL-DRT-15-0316
CMOS image sensors (CIS) address different applications ranging from medical field (X-rays) to videosurveillance (visible part of the spectrum), as well as thermal imaging (Infra-Red). An important feature of CIS consist in their ability to detect low level of light. That's why electronic noise has raised much interest the past few years.
Ion beam analysis of 3-D structures for microelectronics of the Future
Offer N°: SL-DRT-15-0277
3D integration of components is one of the strategies to improve the performance of integrated circuits for advanced technology nodes. This PhD project will focus on the physicochemical characterisation of 3D structures (transistors, imagers)at a key step of their fabrication called doping, which aims at modifying the conductivity.