Development of III-V on Silicon Heterogeneous lasers for high temperature continuous operation
Offer N°: SL-DRT-16-0717
Silicon photonics (compatible with the high volume/ low-cost CMOS fabrication technology) is an emerging industrial technology enabling the 3D-tight integration of photonic ICs with their analog driving electronic ICs. Lower cost, lower footprint, and lower-power solutions are expected for short reach data-transmissions ranging from rack-to-rack and board-to-board between System-In-Packages.
Optical brursts integrated switchs
Offer N°: SL-DRT-16-0707
The increase in the data rate of intra or inter processor transmissions, linked to stringent constraints in terms of latency, seem to lead to the requirement for very high speed (50-100Gbps) point to point optical links integrated into the electronics. However, these links appear to be underused (10-15% of the time only) and due to their simple point to point architecture imply the use of numerous transceivers.
New processing algorithms of X-ray spectral measurements
Offer N°: SL-DRT-16-0690
The LDET laboratory from LETI is currently at the forefront of the development of multi-energy X-ray detectors with high counting rate, for security applications, non-destructive testing and Medicine. These detectors provide the full energy spectrum of measured photons; consequently, new processing algorithms are required to take into account all the available information. First processing bricks have already been developed by the LDET, nonetheless an in-depth work is necessary.
SHM by reflectometry for 2D and 3D structures
Offer N°: SL-DRT-16-0675
Nowadays, reflectometry methods are well introduced for the diagnosis of wire networks. These methods, based on the injection of a waveform and on the measurement of the reflected wave are used to detect, characterize and localize one or more defects. However, reflectometry methods have rarely been applied to higher order structures (2D and 3D).