Thesis, internship, and post-doc opportunities
Development of low-k dielectrics for sequential 3D integration
Offer N°: SL-DRT-15-1128
Low-k dielectrics are used for insulation of interconnect levels in integrated circuits. For new applications (sequential 3D integration), it becomes necessary to have low-k materials capable of withstanding high thermal budgets (up to 550 ° C). "Conventional" materials (SiOCH or SiCNH deposited by PECVD) does not a priori meet these specifications.
Photoactivation of iron nanoparticles vectorized by tumor associated macrophages to improve tumor treatment
Offer N°: SL-DSM-15-1143
A novel approach for the treatment of tumors consists in using the interaction between X-rays and a drug which has been beforehand internalized into the tumor. This cancer therapy is based on the photo-activation of high atomic number elements, leading to a local dose enhancement delivered to the tumor cells by radiations. This dose enhancement is arising from secondary and Auger electrons created after photoelectric interactions.
Advanced plasmonics for the study of biological events
Offer N°: SL-DSM-15-1104
The Spram, the LN2 (Sherbrooke) develop new and complementary optical approaches to measure biological interactions. New ideas are emerging from these recent progresses in advanced plasmonics and we propose to study the behavior of bacteria interacting with solid surfaces.
MBE/CVD growth of optimized 2D transition metal dichalcogenides and in situ synchrotron x-ray scattering investigations of their structural properties
Offer N°: SL-DSM-15-1076
Like graphene, 2D transition metal dichalcogenides (TMDs) are more and more investigated because they have interesting new electrical, chemical, mechanical or thermal properties especially when in the form of a single layer. However, the single layer TMDs produced to date by e.g. exfoliation are structurally very imperfect, which is detrimental for future applications.