Thesis, internship, and post-doc opportunities

156 results found

[Thesis]

Colocalized nano-characterization of defaults and luminescence in InGaAs/GaAs quantum well

Offer N°: SL-DRT-15-1121

Start date: 1 Sep 2015

Integration of III-V materials grown on silicon substrate for nanoelectronic applications (high mobility transistors for example) is conditioned by the high quality of the material. This work is in the field of the nanocharacterization of extended defects in III-V material grown by epitaxy on silicon.



[Thesis]

Study of adhesions in polymer bonding for microelectronic applications

Offer N°: SL-DRT-15-1117

Start date: 1 Oct 2015

The subject deals with polymer bonding as used in microelectronics. Adhesive bonding is widely used: MEMS and microfluidic devices elaboration or for wafer to wafer transfer of thin films and devices for 3D applications. The goal of the PhD is to better understand the mechanism involved in the polymer bonding processes and to propose improvements. The results will be applied to the case of temporary bondings.

Work description (13 lines maximum):



[Thesis]

Development of low-k dielectrics for sequential 3D integration

Offer N°: SL-DRT-15-1128

Start date: 1 Oct 2015

Low-k dielectrics are used for insulation of interconnect levels in integrated circuits. For new applications (sequential 3D integration), it becomes necessary to have low-k materials capable of withstanding high thermal budgets (up to 550 ° C). "Conventional" materials (SiOCH or SiCNH deposited by PECVD) does not a priori meet these specifications.



[Thesis]

Advanced plasmonics for the study of biological events

Offer N°: SL-DSM-15-1104

Start date: 1 Nov 2015

The Spram, the LN2 (Sherbrooke) develop new and complementary optical approaches to measure biological interactions. New ideas are emerging from these recent progresses in advanced plasmonics and we propose to study the behavior of bacteria interacting with solid surfaces.



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