Thesis, internship, and post-doc opportunities
Ultra fine pitch interconnections and their application to optoelectronics devices
Offer N°: SL-DRT-14-0663
Ultra fine pitch interconnections are recognized as one of the most important challenges in the field of microelectronics, as well as next generation photonics devices using the Silicon Photonics technology. These two topics are studied at CEA/Leti, in the Photonics & Optoelectronics Department. They required a critical technology to be developed : fine-pitch (<10µm) interconnections using microbumps.
Propagation channel modelling for Mobile-to-Mobile wireless communications
Offer N°: SL-DRT-14-0625
The PhD thesis here proposed is in the field of channel propagation modeling for inter-vehicle and inter-objects wireless communications.
Study and implementation of new GaN bidirectional transistors in high-performance power electronic structures
Offer N°: SL-DRT-14-0664
In recent years, significant progress has been made on new material: Silicon Carbide (SiC) , gallium nitride (GaN ) and Diamond. The JFET and MOSFET SiC components are more suited to high voltage while the GaN components can compete with silicon components up to 600V or 1200V . For the latter, the lateral technology makes it easier to achieve bidirectional current and voltage components without significantly degrading the state.