Thesis, internship, and post-doc opportunities

135 results found

[Thesis]

Gallium nitride nanowire heterostructures

Offer N°: SL-DSM-15-0510

Start date: 1 Oct 2015

The objectives of this thesis are focused on achieving two types of heterostructures based on gallium nitride (GaN) wires, which have both a strong fundamental interest and well-identified applications:



[Thesis]

MEMS Micro-systems encapsulation using 3D printing

Offer N°: SL-DRT-15-0771

Start date: 1 Oct 2015

Microelectronic extends its range of applications via the micro-systems comprising sensors, energy scavengers, high performance communication and low consumption modules. Thus, encapsulation and functional hermetic lid manufacturing are becoming more and more relevant. Indeed, metallic and polymer additive manufacturing (3D printing) allows more and more complex and heterogeneous design building and guaranty a good versatility and low costs.



[Thesis]

An imaging system for the characterization of the skin layers by diffuse reflectance

Offer N°: SL-DRT-15-0341

Start date: 1 Oct 2015

The skin is a complex organ organized in several layers (stratum corneum, epidermis, dermis) that provides a bidirectional exchange between the body and its environment. Access to these different layers is required to characterize and diagnose skin diseases such as cancer, psoriasis… Diffuse reflectance spectroscopy (DRS) consists in illuminating the tissue surface while spectrally analysing the reflected light after photons interaction with the living tissues constituents.



[Thesis]

Optimization of nanosecond laser and micro-wave annealing by numerical simulation for 3D integration in nanoelectronics

Offer N°: SL-DRT-15-0752

Start date: 1 Sep 2015

CEA-LETI develops leading edge manufacturing processes for the advanced technology nodes in nano-electronics, and effectively transfers this knowledge to the industry. Cool-Cube® is a challenging and promising option developed at LETI to build integrated 3d components. This technology, as well as other key enabling technologies, requires new annealing processes.



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