Thesis, internship, and post-doc opportunities
MEMS Micro-systems encapsulation using 3D printing
Offer N°: SL-DRT-15-0771
Microelectronic extends its range of applications via the micro-systems comprising sensors, energy scavengers, high performance communication and low consumption modules. Thus, encapsulation and functional hermetic lid manufacturing are becoming more and more relevant. Indeed, metallic and polymer additive manufacturing (3D printing) allows more and more complex and heterogeneous design building and guaranty a good versatility and low costs.
In-operando characterization of advanced devices by photoelectron spectroscopy
Offer N°: SL-DRT-15-0473
Recent technological developments make possible real-time characterization of devices in operating conditions. This analysis is of upmost importance since it will allow a better understanding of the physico-chemical mechanisms that take place when applying an external stress, such as thermal (inter-diffusions), electrical (creation of conductive paths) or chemical ones.
Optimization of nanosecond laser and micro-wave annealing by numerical simulation for 3D integration in nanoelectronics
Offer N°: SL-DRT-15-0752
CEA-LETI develops leading edge manufacturing processes for the advanced technology nodes in nano-electronics, and effectively transfers this knowledge to the industry. Cool-Cube® is a challenging and promising option developed at LETI to build integrated 3d components. This technology, as well as other key enabling technologies, requires new annealing processes.
Study of inter-pixel surface states for semiconductor X-ray detectors
Offer N°: SL-DRT-15-0373
As part of its activities in medical imaging, LETI has developed over several years a new technology of detectors based on CdTe/CdZnTe semiconductor material, in order to offer new performance X-ray and gamma-ray imaging for different applications like radiology, CT scanner, gamma-camera, and non-destructive testing. The first prototypes have shown an interest in improving image quality and dose reduction.