Thesis, internship, and post-doc opportunities

139 results found


Design of microneedles (MN) based on biocompatible polymers for enhanced skin vaccinal delivery.

Offer N°: SL-DRT-16-0650

Start date: 1 Oct 2016

The Division of Technologies for Biology and Health Care in the CEA institute at Grenoble (France) designed new medical devices to improve diagnosis and treatment of patients. Transdermal delivery is generally well-liked by patients and allows the permeation of drugs across the skin and into the systemic circulation thus avoiding the hepatic-first pass effect observed during oral administration and the inconvenience of frequent parenteral administration.


Correction of scatter radiation in spectral tomographic imaging

Offer N°: SL-DRT-16-0670

Start date: 1 Oct 2016

X-ray imaging is a well-known technique used in the medical diagnostic domain, testing of industrial samples, and security. Conventional X-ray detectors provide a signal proportional to the energy of photons deposited into the detector, integrated on the total energy range.


Ion-beam-induced migration of HgCdTe dopants and application to p-n junction formation

Offer N°: SL-DRT-16-0649

Start date: 1 Sep 2016

HgCdTe crystal is a semiconductor material with the unusual feature to be highly ion-beam sensitive. This thesis proposal covers the specificity of this material to exhibit a migration of dopants under ion-beam irradiation. This specificity, demonstrated for some dopants of HgCdTe, is of major technological interest by letting foreseen the possibility to finely tune p-n junction.


III-V materials etch process development for power device application

Offer N°: SL-DRT-16-0299

Start date: 1 Sep 2016

Power devices are now widely used in new technologies like photovoltaic, electrical cars…. The use of III-V materials allowed to strongly improve these device performances. But one of the most critical challenge in the realization of such structures is the precise etching (without damage) of III-V films.

The goal of the proposed thesis is first to study the III-V materials etch mechanism using conventional etch chemistries and understand the damage induced by these chemistries.

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