Thesis, internship, and post-doc opportunities

100 results found

[Thesis]

Next-generation sugar biochips for biodetection

Offer N°: SL-DSM-16-0410

Start date: 1 Sep 2016

Sugars are ubiquitous biomolecules in Nature as they are implied in a lot of cellular processes such as adherence, recognition and inter-cell communication. The study of their interactions with proteins, cells or bacteria is of great interest for deciphering these complex prosesses. Moreover, sugars display chemical and strutural diversities wider than those of DNA strands (4 bases) or proteins (20 amino-acids). They are easy-to-manipulate and much cheaper than antibodies.



[Thesis]

Reliability of lithium niobate-based bulk acoustic wave resonators for improvement of the RF components integrated in Smartphones and connected objects

Offer N°: SL-DRT-16-0385

Start date: 1 Sep 2016

Within CEA-Tech, the technological research division of CEA, the LETI Institute aims at generating innovation and transfer it to industry. It also bridges the gap between fundamental research and industrial production of micro and nano-technology to improve the quality of life. With a portfolio of 2.800 patents, LETI shapes Advanced solutions to improve the competitivness of its industrial partners: large groups, SME or startups.



[Thesis]

3D chemical characterization of nanotechnoly devices by analytical electron tomography

Offer N°: SL-DRT-16-0110

Start date: 1 Sep 2016

Progress in micro and nanotechnology strongly relies on the development of sophisticated structural and analytical tools. The Nano-Characterization Platform of CEA-LETI comprises several state-of-the-art transmission electron microscopes (TEM) dedicated to sub-atomic imaging and spectral analysis. This thesis aims at the development of analytical electron tomography, which is the 3D extension of analytical electron microscopy.



[Thesis]

Fine pitch interconnects, which reliability?

Offer N°: SL-DRT-16-0096

Start date: 1 Sep 2016

Context/State of the art

The interconnect density required by the next generation 3D IC results in a significant reduction of the dimensions of these interconnects. They consist in metallic pillars (copper / nickel) associated with a solder material (tin / silver).

Scientific and technical obstacles



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