News :

June 10 2013

CEA, France’s second-largest patent filer in 2012

  • Industry
  • MINATEC
  • News
  • Research
France’s National Intellectual Property Institute (INPI) issued a list in April of France’s busiest patent fi lers in 2012. The CEA edged up to second place with 566 patent applications, up from 545 in 2011. This puts it just ahead of Safran with 556 applications and well behind leader PSA Peugeot Citroën with 1,348 applications. […] >>

June 10 2013

Aledia powers ahead at light(n)ing speed

  • Industry
  • MINATEC
  • News
  • Research
Aledia, a start-up spun off from Leti, has just crossed two important milestones. First, it has finished making its first series of LEDs on 200 mm silicon wafers—a breakthrough process that cuts LED production costs by a factor of four relative to conventional methods. And second, the young firm has raised €10 million of fresh […] >>

June 10 2013

MEIS looks at nanowire constraints

  • MINATEC
  • News
  • Research
MEIS, or medium-energy ion scattering, off ers very-high-resolution chemical and structural surface analysis capabilities. The technique works by analyzing the energy and angle of backscattered ions, and is frequently used for fl at layers. A team of researchers from INAC and Leti recently came up with an innovation when they used MEIS to study the […] >>

June 10 2013

Leti Innovation Days brings together businesses and researchers

  • Industry
  • Life @ MINATEC
  • MINATEC
  • News
  • Research
Leti’s annual gathering will be held at MINATEC on June 25–28—with one big novelty: this will be the first year of the new format, beefed up considerably relative to the Leti Annual Review. This first edition of the Leti Innovation Days will include a full program of talks and workshops on technical topics. The central […] >>

June 10 2013

Leti sets the stage for 14 nm FDSOI

  • MINATEC
  • News
  • Research
The first 14 nm microelectronic circuits won’t be produced on a large scale until 2015 or 2016—but now is when engineers need to decide which technologies they want to use. That’s why Leti has just put together a 14 nm design kit for one of its flagship technologies: fully-depleted silicon on insulator (FDSOI). The kit […] >>
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