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December 05 2016

Intensity- and sign-tunable spin-charge conversion

  • MINATEC
  • News
  • Research
A joint INAC-CNRS-Thales research team achieved record intensity- and sign-tunable spin-charge conversion in the two-dimensional electron gas at the interface between a layer of strontium titanate and another layer of lanthanum aluminate. The conversion rate was five to ten times higher than with the materials currently used. The researchers worked at 7 K, injecting a […] >>

December 05 2016

MEMS RF switches made in Grenoble ready for space

  • Innovation & Society
  • News
  • Research
MEMS radio-frequency micro-switches developed by Leti could be chosen by the European Space Agency for tomorrow’s space applications. While it is still too early to tell, Leti is doing everything it can to increase its chances of success! First, Leti researchers have integrated the switches into a collective thin-layer packaging—a key advantage over individually packaged […] >>

December 05 2016

Satellite operators hungry for 5G communications

  • Innovation & Society
  • News
  • Research
Satellite operators are actively seeking to determine which type of waves they should focus on to secure a slice of the future 5G market. Research conducted by France’s national space agency CNES at Leti set out to answer this question. The study is assessing four potential types of waves: OFDM, EW-OFDM, PS-OFDM, and FBMC. The […] >>

December 05 2016

Quantum dots perform well under mechanical constraints

  • News
  • Research
Over the past several years, the application of mechanical constraints to semiconducting quantum dots has been broadly used to fine-tune the dots’ emission wavelength to create single-photon sources, for example. Researchers at INAC integrated several InAs quantum dots into a GaAs nanowire coated with an amorphous silicon shell to create quantum dots deformed along their […] >>

December 05 2016

High-performance computing gets more energy-efficient data transfer

  • Industry
  • MINATEC
  • News
  • Research
The 3D-NoC network-on-chip developed by Leti, STMicroelectronics, and Mentor Graphics under a project coordinated by IRT Nanoelec offers 20% to 40% less energy consumption and higher speeds than other NoCs. The NoC developed is built on two 28 nm FDSOI stacked circuits, each with 96 processor cores. The cores are integrated on a 65 nm […] >>
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