CERN chips employ Leti’s TSV technology

Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament connections—which typically cover 6%–10% of a detector’s surface.

Leti’s Open3D® platform develops technology bricks for outside customers for preseries runs. The first chips for the CERN are currently in the testing phase.

Contact: gabriel.pares@cea.fr

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