Leti sets the stage for 14 nm FDSOI

Categorie(s) : MINATEC, News, Research

Published : 10 June 2013

The first 14 nm microelectronic circuits won’t be produced on a large scale until 2015 or 2016—but now is when engineers need to decide which technologies they want to use. That’s why Leti has just put together a 14 nm design kit for one of its flagship technologies: fully-depleted silicon on insulator (FDSOI).

The kit lets engineers compare two different integration methods for a given circuit: 2D, which is the current standard; and monolithic 3D, which many microelectronics industry players see as the next step forward. The kit also helps designers identify and evaluate future fabrication steps. And everything is done virtually, without the need for a physical demonstrator.

The kit has been provided to engineers at Leti and STMicroelectronics (Leti’s FDSOI research partner), and could ultimately be made available to other businesses as well.

Contact: gerald.cibrario@cea.fr

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