News :
September 13 2018
Deposition of oxide thin films via Spatial Atomic Layer Deposition: in search of high quality oxide semiconductors for electronic and optoelectronic applications
Project description In ever more challenging environmental conditions an increasing amount of scientific work is devoted to the investigation of new materials for energy applications. But apart from finding better materials, new processing tools need to be developed allowing the scalable deposition of high quality materials at low temperatures. Atomic Layer Deposition (ALD) is an […] >>
September 13 2018
Optimization of a Spatial Atomic Layer Deposition system by simulation
Project description In ever more challenging environmental conditions an increasing amount of scientific work is devoted to the investigation of new materials for energy applications. But apart from finding better materials, new processing tools need to be developed allowing the scalable deposition of high quality materials at low temperatures. Atomic Layer Deposition (ALD) is an […] >>
January 24 2018
Modeling and simulation of superconducting phi-junctions and bi-SQUIDs
MASTER INTERNSHIP 2018 Modeling & simulation of superconducting phi-junctions and bi-SQUIDs The Laboratory of Microwave and Characterization (IMEP-LAHC, CNRS UMR 5130) of Université Savoie Mont Blanc located in […] >>
January 24 2018
Development of a simulation software of superconducting electronics based on the use of Josephson junctions at terahertz frequencies
MASTER INTERNSHIP 2018 Development of a simulation software of superconducting electronics based on the use of Josephson junctions at terahertz frequencies […] >>
November 30 2017
Optimization of the resistive switching in LaMnO3-based devices
Abstract Recently, resistive random access memories (ReRAM) have generated significant interest both in industry and in the scientific community for their use as non-volatile memory beyond Flash memory scaling. ReRAMs are considered one of the most promising emerging non-volatile memories due to high speed, high density, great scalability and low power consumption. Recent work carried […] >>