News : Technological challenges

January 01 2023

Coupling of advanced characterization techniques to study 2D material growth and integration

Two-dimensional (2D) materials are defined as crystalline solids consisting of a single layer of atoms, making their properties remarkable. Compared to their massive form, they can present outstanding semiconducting characteristics that can be exploited for many applications (CMOS, memories, photonics, photovoltaics, etc.). However, their integration into components via standard microelectronics processes remains a challenge and […] >>

January 01 2023

Cryopenic control electronics dedicated to the control of a matrix of qubits

The recent improvements of quantum bits (qubit) based on electron spins pave the way towards their massive integration into the possible quantum processor of the future quantum computer. The individual biasing, manipulation and reading of particular qubits of the matrix is a key point that forges strong links between physicists and electronics engineers. More specifically, […] >>

January 01 2023

Experimental analysis of a new perovskite material for medical radiography: structural properties, doping, and electro-optical performances

X-rays is the most widely used medical imaging modality for the detection of pathologies, the monitoring of their evolution and during certain surgical procedures. The objective of this thesis is to study a new semiconductor material based on perovskites for direct X-ray detection. A thesis is running since October 2022 at CEA on the development […] >>

January 01 2023

µLaue diffraction and excited luminescence in nitrides optoelectronics: physics, operando, serial crystallography

The Laue microdiffraction instrument (µLaue), installed at the European Synchrotron (ESRF) in Grenoble (BM32 beamline), is unique in Europe and probes the matter by diffracting a polychromatic X-ray beam of a few hundred nanometers. The acquisition of the Laue diffraction diagram is very fast and allows scanning the samples with high precision to get the […] >>

January 01 2023

Horizontal Magnetic Pulses and the Impact of Ultrafast Transient Current on Hardware Security of SoCs

Work carried out within the CEA-Leti has shown that physical attacks can be a threat to the security mechanisms of SoCs (System-On-Chips). Indeed, fault injections by electromagnetic disturbance have already led to an elevation of privileges by authenticating with an illegitimate password, or more recently have made it possible to circumvent one of the highest […] >>
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