Wafer-level testing of photonic circuits speeds up development

Categorie(s) : MINATEC, News, Research

Published : 4 June 2021

Optically-coupled photonic chips cannot currently be tested at wafer level. Instead, they must be cut, packaged, and then tested individually. CEA-Leti successfully demonstrated an automated testing solution that removes this hurdle. A custom probe from Teem Photonics ensures very broad bandwidth and unparalleled measurement dynamics of more than 60 dB. It is capable of characterizing virtually all optical components.

The probe just needs a track in the silicon substrate measuring a few hundred microns in depth to operate. This method could remove a significant barrier to scaling up wavelength multiplexing circuits for manufacturing. The advance is one of the results of the European Masstart project, which runs until the end of 2021.

Contact: camille.giroud@cea.fr

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