News : DOPT

January 01 2023

Optical coupling between high power lasers and photonic circuits for LiDAR applications

Silicon photonics was initially developed for high-performance telecommunications, but new applications quickly emerged. These include the development of LiDARs (Light Detection And Ranging) intended for environmental imaging for vehicles and autonomous systems. Indeed, existing LiDARs are made of discrete components whose mechanical assembly makes them fragile, expensive and bulky. By using a photonic chip, the […] >>

January 01 2023

Development of a fully passive plenoptic thermal imaging system

Uncooled thermal infrared cameras, based on the micro-bolometer technology, are present in several domains of application: industrial monitoring, automotive, automation, defense … To follow those high volume markets, there is a strong competition to develop more performant focal plane arrays, with smaller pixel pitch and including innovative optical functionalities. In this miniaturization context and optics […] >>

January 01 2023

Study of sidewall physical mechanisms involved in GaN µ-LEDs performance

In the Optics and Photonics division of CEA-LETI, The Emissive Components Laboratory designs and fabricates micro-displays based on GaN micro-LEDs. One of the major issue of GaN µ-LEDs is the decrease of their efficiency with the size reduction. In literature, this degradation is attributed to SRH (Shockley-Read-Hall) non-radiative recombinations on pixel sidewalls, in defects induced […] >>

January 01 2023

Novel optical systems for laser chip to photonic circuit coupling – Applications for sensor and LIDARs

The development of silicon photonics technology has made it possible to integrate numerous photonic functions on the same chip, as close as possible to electronic functions, allowing the miniaturization of components in the fields of datacoms, telecoms and optical sensors. However, optical communication from chip to chip remains a key point to be developed (in […] >>

January 01 2023

Study and fabrication of microoptics integrated to an infrared focal-plane array

In recent years, the infrared imaging market has trended towards pixel size reduction. Interpixel crosstalk is a major limitation of small pitch devices, as it reduces the image resolution via the degradation of the modulation transfer function. The aim of this thesis is to study and fabricate pixel-level microoptics capable of reducing the crosstalk. The […] >>
More information
X