News :
October 06 2013
Gold nanoparticles help fight brain tumors
- News
- Research
Imagine eradicating brain tumors by injecting them with gold nanoparticles and activating the particles with synchrotron radiation. That’s the groundbreaking new approach being developed at ESRF by researchers from INAC and INSERM. They successfully tested the new procedure on rodents, improving survival rates significantly compared with a control group treated with radiation alone. Because the […] >>
October 06 2013
Non-destructive surface testing goes 50 nm deep
- Events
- News
- Research
In a world first, a team of French and Danish researchers from Leti and STMicroelectronics successfully performed non-destructive testing on a CMOS stack layer embedded at a depth of more than 50 nm, locating it to within 10% accuracy. The team, working at ESRF, used X-ray photoelectron spectroscopy—a method until now used exclusively for extreme […] >>
June 10 2013
Productive fun in store at the 2013 Phelminaire
- Education
- Innovation & Society
- Life @ MINATEC
- MINATEC
- News
The 2013 Phelminaire, a day-long seminar for Grenoble Institute of Technology-Phelma faculty and staff, will be held at the school’s campus on July 1, 2013. Some 100 people are expected to attend. The morning program will include a series of small-group workshops on teaching-related issues, using fun activities like role-playing games and panel discussions to […] >>
June 10 2013
Leti traces its SOI history in a new book
- Industry
- Innovation & Society
- Life @ MINATEC
- MINATEC
- News
- Research
In a new book called Des Hommes et des Ions (“Of Ions and Men”), French journalist Isabelle Doucet tells the story of how Leti researchers—including Michel Bruel, Alain Soubie, and Jean-François Michaud—studied and revolutionized microelectronics R&D with their work on silicon-on-insulator (SOI) technology. The book is subtitled Chroniques d’une Aventure Humaine (“Chronicles of a Human […] >>
June 10 2013
CERN chips employ Leti’s TSV technology
- Industry
- MINATEC
- News
- Research
Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>


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