News :

Leti is extending its 3D integration roadmap with its CoolCube® technology developed in conjunction with several industrial R&D partners including IBM and STMicroelectronics. The technology attains 10 million 3D contacts per mm2, a huge increase over the 100,000 contacts delivered by traditional solutions. With CoolCube®, FDSOI transistors are stacked and interconnected with pattern alignment accurate […] >>

Resistive memory (ReRAM) is a thousand times faster than flash memory and will likely replace flash in coming years. Leti is already working on ReRAM with industrial R&D partners, and has designed a tool to improve memory performance that calculates the main ReRAM design constraints (some of which are in conflict with others). The calculator […] >>

Researchers at Leti have tested in real-world conditions a power converter capable of operating at an ambient temperature of 200 °C (and up to around 250 °C). High temperatures like these are common in automotive, aeronautics, and oil and gas drilling applications. Leti’s technology could also reduce—or eliminate entirely—the need for cooling systems in less-demanding […] >>

At the end of September LMGP presented its new SALD (Spatial Atomic Layer Deposition) reactor to MINATEC. It is the first reactor of its kind in France. It operates at atmospheric pressure, bringing down costs, and can perform atomic layer deposition up to 100 times faster than traditional ALD equipment. And the resulting layers are […] >>

A traditional Josephson junction has two superconducting terminals. But researchers at Inac* recently looked at the theoretical behavior of four-terminal junctions—and the idea was an excellent one! The researchers predicted that, by applying a different voltage to two of the terminals, they would obtain the alternative current that characterizes the Josephson effect and a totally […] >>