News :

Leti and Liten have combined the performance of silicon and the flexibility of printed electronics to functionalize any planar or curved surface, from window glass and smartphone cases to wristbands and robot fingers. The researchers began work on these advances under a Carnot-funded project. Leti made a test vehicle (a silicon chip thinned to 40 […] >>

Clinatec’s Brain-Computer Interface (BCI) project was recently featured in The Lancet Neurology* and has appeared in the media worldwide. This groundbreaking project shows just how powerful the Clinatec model—medical doctors and technology experts working side-by-side under one roof—is at driving innovation.   The WIMAGINE® implantable medical device is the first technology brick in Clinatec’s BCI […] >>

The SICOM (Signal, Image, Communication, and Multimedia) major common to Grenoble Institute of Technology schools Phelma and Ense3 prepares future engineers capable of developing projects that involve signal processing, electronics, and IT. The curriculum, which has been around for a decade, was recently updated to incorporate additional course content on data science and artificial intelligence. […] >>

The Soitec-Leti Substrate Innovation Center will open a SiC (silicon carbide) pilot line in 2020 as part of a joint development program recently announced by Soitec and Applied Materials. The partners will develop solutions for electric vehicles, telecommunications, and other markets. SiC is already a leading material for these applications. However, it is less common […] >>

For the fifth year running, Leti will exhibit at CES (Consumer Electronics Show) in Las Vegas in January 2020. This year, the institute will unveil four technologies. The first is a miniaturized lensless microscope for cellular analysis and point-of-care diagnostics. Coupled with AI, this lensless technology delivers a fast, simple, and effective preliminary diagnosis. The […] >>