News :
October 01 2022
Back to school at Grenoble INP – Phelma, UGA
- Education
- Life @ MINATEC
- News
The 2022-23 school year is underway at Grenoble INP – Phelma, UGA, with an incoming cohort similar to last year’s.On September 2, first-year students arrived on campus: 370 in the traditional engineering program and 26 in the internship-based program in microelectronics and telecommunications. A majority—77%—came from general prep programs, 12% from the INP prep program, […] >>
October 01 2022
Fundraising: CEA-Leti startups bring in €25 million
- Industry
- MINATEC
- News
- Research
Grenoble-based Scintil Photonics and eLichens, both startups developing CEA-Leti technologies, raised €25 million in capital over the summer.Scintil Photonics raised €15 million in two separate fundraising rounds in June and September. The company’s silicon photonic integrated circuits push server-to-server data transmission speeds over the terabit-per-second mark in data centers, cloud computing, and telecommunications. The influx […] >>
October 01 2022
Biomimetic adhesive expert joins LMGP
- Education
- Innovation & Society
- MINATEC
- News
- Research
Charlotte Vendrely, formerly of Cergy-Pontoise University, has joined the faculty of Grenoble INP-Phelma, UGA. She had just completed a one-year placement in Grenoble while still at her former institution, and will now teach classes in the biomedical engineering program and conduct research at LMGP.A biomimetic adhesive specialist, Vendrely has been coordinating the BioAd project, backed […] >>
October 01 2022
More reliable urban CO2 mapping
- Industry
- Innovation & Society
- News
- Research
CEA-Leti designed a secure circuit board to provide near-sensor data processing. The boards, made up of microcontrollers and hardware security chips, will be tested on CO2 sensors in major cities in 2023.Once the data gathered by the sensors is processed, it will be sent to a blockchain to ensure full traceability, and then saved to […] >>
October 01 2022
3D integration: chip-to-wafer bonding alignment 10x more accurate
- Education
- News
- Research
An innovative magnetic sensor to help align chip-to-wafer bonds for 3D integrated circuits was recently developed and patented by a team of scientists at Irig.When used in optimal conditions, the sensor is accurate to within 50 nm: ten times better than the 500 nm today’s optical solutions can achieve. The improvement could help substantially increase […] >>


Contact us
How to find us






