News : Industry

October 06 2013

Learn more about advanced characterization

  • Education
  • Industry
  • Life @ MINATEC
  • MINATEC
  • News
  • Research
A conference entitled “Advanced Characterization Techniques: Opportunities for Industry” will be held on November 14 at ILL as part of IRT Nanoelec programming. The conference is open to both researchers and students, but will mainly target professionals from the world of industry seeking to learn more about materials characterization and what Grenoble’s characterization resources—from labs […] >>

October 06 2013

Coming soon: a fully-microelectronic CO2 sensor

  • Industry
  • Innovation & Society
  • News
  • Research
Leti is planning to develop an optical CO2 sensor using all-MEMS technology, including an emitter, detector, and infrared optical system. It will be no bigger than 1 cm3 and require no more than 6 mW of power. This will be the first step towards an even smaller sensor that could be used in cell phones, […] >>

June 10 2013

Lens-free virus viewing thanks to a webcam

  • Industry
  • MINATEC
  • News
  • Research
It may soon be possible to view cells, bacteria, and viruses without a lens by using a simple webcam CMOS image sensor and LED lights. While this may sound like something concocted by a mad scientist, it is in fact a practical idea that Leti and UCLA researchers have been working on for the past […] >>

June 10 2013

BeSpoon sets a world record at 3,641 meters

  • Industry
  • News
  • Research
Locating an object to within just a few centimeters sounds easy—except when you are over 3.6 km away. But that’s what French start-up BeSpoon was able to do using impulse radio ultra-wideband (IR-UWB) technology developed by Leti. This range of 3,641 meters sets a world record based on emergency situation UWB regulations; the range based […] >>

June 10 2013

CERN chips employ Leti’s TSV technology

  • Industry
  • MINATEC
  • News
  • Research
Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>
More information
X