News : Industry
June 10 2013
Crocus Technology commits for five years
- Industry
- MINATEC
- News
Crocus Technology’s R&D partnership with Spintec is changing tempo. After years of working through renewable one-year agreements, the duo have committed to a five-year agreement (2013–2017) to form a joint lab guaranteed to employ a set number of people. This move comes just ahead of Crocus Technology’s launch of industrial scale production. Its R&D with […] >>
June 10 2013
CEA, France’s second-largest patent filer in 2012
- Industry
- MINATEC
- News
- Research
France’s National Intellectual Property Institute (INPI) issued a list in April of France’s busiest patent fi lers in 2012. The CEA edged up to second place with 566 patent applications, up from 545 in 2011. This puts it just ahead of Safran with 556 applications and well behind leader PSA Peugeot Citroën with 1,348 applications. […] >>
June 10 2013
Lens-free virus viewing thanks to a webcam
- Industry
- MINATEC
- News
- Research
It may soon be possible to view cells, bacteria, and viruses without a lens by using a simple webcam CMOS image sensor and LED lights. While this may sound like something concocted by a mad scientist, it is in fact a practical idea that Leti and UCLA researchers have been working on for the past […] >>
June 10 2013
BeSpoon sets a world record at 3,641 meters
- Industry
- News
- Research
Locating an object to within just a few centimeters sounds easy—except when you are over 3.6 km away. But that’s what French start-up BeSpoon was able to do using impulse radio ultra-wideband (IR-UWB) technology developed by Leti. This range of 3,641 meters sets a world record based on emergency situation UWB regulations; the range based […] >>
June 10 2013
CERN chips employ Leti’s TSV technology
- Industry
- MINATEC
- News
- Research
Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>