News : MINATEC

Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>

The 17 Grenoble-based members of IRT Nanoelec will meet at MINATEC on June 24, 2013 to celebrate the research institute’s first anniversary. All seven of the planned R&D projects have been kicked off since the institute was created in April 2012, including projects on 3D integration and photonics on silicon—the system’s core technology. The project […] >>

In a ceremony at MINATEC on March 26, 2013, Jean Therme, head of France’s Atomic and Alternative Energy Commission (CEA), awarded the Knight of the French National Order of Merit medal to Philippe Mallein, an innovation and user-driven design consultant for CEA-DRT and for MINATEC’s IDEAs Lab, which he helped establish. Mallein sees himself as […] >>

France’s National Intellectual Property Institute (INPI) issued a list in April of France’s busiest patent fi lers in 2012. The CEA edged up to second place with 566 patent applications, up from 545 in 2011. This puts it just ahead of Safran with 556 applications and well behind leader PSA Peugeot Citroën with 1,348 applications. […] >>

Aledia, a start-up spun off from Leti, has just crossed two important milestones. First, it has finished making its first series of LEDs on 200 mm silicon wafers—a breakthrough process that cuts LED production costs by a factor of four relative to conventional methods. And second, the young firm has raised €10 million of fresh […] >>