Deposition techniques: ALD gains traction

Categorie(s) : News, Research

Published : 1 June 2019

Atomic layer deposition (ALD) has become a technique of choice for depositing very thin films. However, the technique does have the disadvantage of being very slow. For the first time ever, speeding up the process appears to be within reach. A recent article by David Muñoz-Rojas (LMGP), Tony Maindron (Leti), and other ALD experts outlined four approaches that  substantially reduce deposition times: batch ALD (processing several substrates simultaneously); spatial ALD (developed and used at LMGP, this approach is 100 times faster than conventional ALD); optimized geometries and reactor operation; and adjusting the process (the injection-purge sequence). The authors also pointed out the role of modelling in speeding up the ALD process. All of this is good news for faster ALD!


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