Fraunhofer and Leti sign novel microelectronics partnership
Categorie(s) : Life @ MINATEC, News, Research
Published : 3 October 2017
Berlin-based Fraunhofer Group for Microelectronics and Leti signed a new partnership agreement at Leti Innovation Days in June. The agreement will build on existing collaboration between the partners and will cover R&D projects on FDSOI and More than Moore to enable the use of next-generation components in automotive and aeronautics systems, IoT, augmented reality, and healthcare. The two institutes will join forces on these R&D projects to help ensure that France and Germany maintain their positions of leadership on the global microelectronics market.