News : Engineering sciences

January 01 2023

Development of Smart Beamforming Architectures for 6G Telecommunication Systems

Over the past 20 years, wireless communication systems have continued to evolve and offer new services. Today, the success is such that the frequency bands below 10GHz are saturated and we are now turning to millimeter band frequencies. These frequencies offer the possibility to develop systems with higher data rates. However, they require beamforming to […] >>

January 01 2023

Resonant antenna sensors for harsh environments

Microsystems sensors (MEMS) are the interface between the physical world and the digital world, and they are present today in most components and systems. A major challenge is the development of sensors that can be interrogated remotely, without electronic circuits or batteries, which will make it possible to envisage new applications as for example in […] >>

January 01 2023

Study of self-healing mechanisms for embedded systems

While topics around protection mechanisms or threat detection are currently well covered, post-attack repair is still not very present in the scientific literature. Objectives: The objective of this thesis is to identify solutions to restore critical functions or tasks of an embedded device after the detection of an unwanted event (due to a malicious attack […] >>

January 01 2023

Study of sidewall physical mechanisms involved in GaN µ-LEDs performance

In the Optics and Photonics division of CEA-LETI, The Emissive Components Laboratory designs and fabricates micro-displays based on GaN micro-LEDs. One of the major issue of GaN µ-LEDs is the decrease of their efficiency with the size reduction. In literature, this degradation is attributed to SRH (Shockley-Read-Hall) non-radiative recombinations on pixel sidewalls, in defects induced […] >>

January 01 2023

Novel optical systems for laser chip to photonic circuit coupling – Applications for sensor and LIDARs

The development of silicon photonics technology has made it possible to integrate numerous photonic functions on the same chip, as close as possible to electronic functions, allowing the miniaturization of components in the fields of datacoms, telecoms and optical sensors. However, optical communication from chip to chip remains a key point to be developed (in […] >>
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