All News
June 02 2014
Six motion sensors on just 4 mm2 of silicon
- MINATEC
- News
- Research
Tronics recently presented a revolutionary MEMS concept invented by Leti. The new MEMS packs in an impressive three accelerometers and three gyrometers on just 4 mm2 of silicon. The ultra-compact system will target the mobile phone market where it will enhance features like gaming and switching mobile phone cameras from portrait to landscape mode. There […] >>
June 02 2014
Nanometric deformation measurement just got even more accurate
- Industry
- News
- Research
The Nanocharacterization Platform has just achieved a world first: measuring SOI transistor deformation with spatial resolution under 2 nm. The breakthrough was made possible thanks to the addition of precession electron diffraction to the Titan transmission electron microscope. A set of lenses was used to rotate the beam, increasing the number of diffraction spots. The […] >>
June 02 2014
The Internet of Things gets a new architecture model
- Innovation & Society
- News
- Research
The Internet of Things has just made a giant leap forward with the EU-funded IoT-A project (completed late last year). As members of the project consortium, Leti and List helped to develop the Architecture Reference Model (ARM) methodology to develop architectures for virtually any set of internet-connected heterogeneous objects that interact with their environment. ARM […] >>
June 02 2014
Spin-orbit interaction breathes new life into MRAMs
- News
- Research
Over the past few months, Spintec has been completing the fabrication of the first generation of a new kind of MRAM likely to push back the limits of the previous generation of MRAM. The new SOT-MRAM (for spin-orbit torque) leverages spin-orbit interaction to multiply the number of current pathways used during the read and write […] >>
June 02 2014
Piezoelectric stack integration time slashed by 70%
- Industry
- News
- Research
A team of researchers from Leti and Mitsubishi has developed a process that leverages a new piezoelectric material developed by Mitsubishi. According to the researchers’ estimates, the process could cut by 70% the time needed to integrate a piezoelectric stack measuring around 2 microns thick into RF capacitors and actuators. The innovation hinges upon a […] >>


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