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June 10 2013

BeSpoon sets a world record at 3,641 meters

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Locating an object to within just a few centimeters sounds easy—except when you are over 3.6 km away. But that’s what French start-up BeSpoon was able to do using impulse radio ultra-wideband (IR-UWB) technology developed by Leti. This range of 3,641 meters sets a world record based on emergency situation UWB regulations; the range based […] >>

June 10 2013

N+1 theater company camps out at the CEA

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  • Life @ MINATEC
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The N+1 theater company, currently in residency at Atelier Arts-Sciences, will set up its third and last camp on June 10–14, 2013, in a yurt in front of CEA building 20.33. While there the thespians will investigate how researchers get their ideas. The theater company will work with a core team of scientists and engineers […] >>

June 10 2013

Productive fun in store at the 2013 Phelminaire

  • Education
  • Innovation & Society
  • Life @ MINATEC
  • MINATEC
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The 2013 Phelminaire, a day-long seminar for Grenoble Institute of Technology-Phelma faculty and staff, will be held at the school’s campus on July 1, 2013. Some 100 people are expected to attend. The morning program will include a series of small-group workshops on teaching-related issues, using fun activities like role-playing games and panel discussions to […] >>

June 10 2013

Leti traces its SOI history in a new book

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  • MINATEC
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In a new book called Des Hommes et des Ions (“Of Ions and Men”), French journalist Isabelle Doucet tells the story of how Leti researchers—including Michel Bruel, Alain Soubie, and Jean-François Michaud—studied and revolutionized microelectronics R&D with their work on silicon-on-insulator (SOI) technology. The book is subtitled Chroniques d’une Aventure Humaine (“Chronicles of a Human […] >>

June 10 2013

CERN chips employ Leti’s TSV technology

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  • MINATEC
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Leti’s Open3D® integration platform has another prestigious contract under its belt. The platform was used to develop through-silicon vias (TSVs) for chips designed by the CERN and manufactured by IBM. The TSVs make it easier to assemble the ASIC chips used in pixel array detectors for high-energy particles, since they eliminate the need for filament […] >>
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