Diamonds are a 3-D micro-supercapacitor’s best friend
Satellite operators hungry for 5G communications
Intensity- and sign-tunable spin-charge conversion
High-performance computing gets more energy-efficient data transfer
Quantum dots perform well under mechanical constraints
MEMS RF switches made in Grenoble ready for space
DNA could bring new innovations to microelectronics
Recent advances in research being conducted by Leti and INAC scientists under CEA project A3DN could help overcome one of the major technological hurdles facing microelectronics R&D.
So, what does DNA have to do with microelectronics? DNA strings measure around a nanometer—as do the pattern geometries the researchers are working on. And DNA’s base-pairing capacities can ensure more accurate pattern alignment than the most powerful microelectronics technologies currently available.
Pattern alignment—between active circuit components or levels—has to be perfect for the electronic signals to be transmitted. The smaller the geometries, the more difficult it is to align the patterns.
We are going to CES 2017 to raise our profile
What is Leti’s strategy for CES 2017?
Our booth will be twice as big as last year’s. We will showcase three interactive demonstrator systems that will let visitors experience and test our technologies and understand the technologies’ features.
Three startups will be coming with us: e-Lichens, with us in 2016; Moovlab, which was just created; and Sublimed, a Liten startup that illustrates Grenoble’s innovation model very well.
Leti is exhibiting for the second time. What are your goals?
We really want to raise our profile and let the world know about what we do. We will sell our strengths, both to potential corporate R&D partners...